VeriSilicon – Profile

Interesting, Chinese low-cost ASIC design engineer body shop, the day is near… 🙂

VeriSilicon – Profile:
HQ: SHANGHAI, China Founded: 2001 Management: CEO is Wayne Dai, who was the Co-Chairman and CTO of Celestry Technologies, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, Chairman, and CEO of Ultima Interconnect Technology. He has a Ph.D. degree in Electrical Engineering, from UC Berkeley and was a professor at UC Santa Cruz. Investors: In August 2005, Verisilicon closed Series B with US$13.5M. New investors included Intel Capital, HSBC Private Equity (Asia), CID Group, Legend Capital, KTB/UCI, International Finance Corporation (IFC). Existing investors were WI Harper Group, IDG Technology Venture Investment, iGlobe Partners, and Harbinger Ventures. Business Model: Verisilicon is an ASIC design foundry; aka – a low-cost chip engineer body shop. Services range from a design and verification platform, IP, front-end and back-end design services, software design service and turn-key services for China based foundries. VeriSilicon had 140 engineers prior to its latest round of funding. Competitors: Faraday Technology, Paradigm Works, ViASIC. Dirt: Even as Intel has added more and more functionality to its chips, the demand for specialized chips continues unabated. VeriSilicon has proven that it can do good work in China – and for much less than shops…

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